Breakthrough 3D wiring architecture enables 10,000-qubit quantum processors

The novel 3D wiring architecture and chip fabrication method enable quantum processing units containing 10,000 qubits to fit in a smaller space than today's 100-qubit chips.

A 3D rendering of the quantum processing unit.
A rendering of the VIO-40K QPU.
(Image credit: QuantWare)

Scientists say they've developed a breakthrough 3D wiring solution that allows a 100-fold increase in the number of quantum bits (qubits) a quantum computing chip can support.

Typical quantum computing processors (QPUs) are built with two-dimensional, horizontal wiring, just like the central processing units (CPUs) in our classical devices. But this traditional wiring limits the number of qubits scientists can cram onto a given processor. Currently available chips from Google and IBM, for example, contain approximately 105 qubits and 120 qubits, respectively.

Tristan is a U.S-based science and technology journalist. He covers artificial intelligence (AI), theoretical physics, and cutting-edge technology stories.

His work has been published in numerous outlets including Mother Jones, The Stack, The Next Web, and Undark Magazine.

Prior to journalism, Tristan served in the US Navy for 10 years as a programmer and engineer. When he isn’t writing, he enjoys gaming with his wife and studying military history.

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