'Earthquake on a chip' uses 'phonon' lasers to make mobile devices more efficient

A new technology that generates tiny, earthquake-like effects could shake up the wireless device industry with smaller, less power-hungry devices, scientists say.

Mans hand holding a mobile phone. Conceptual with space for copy.
(Image credit: Catherine Falls Commercial/Getty Images)

Engineers have created a device that produces tiny, earthquake-like vibrations on the surface of a chip. They say it could one day be harnessed for signal processing inside everyday electronics, potentially paving the way to smaller, faster and more efficient wireless devices.

In a new study published Jan. 14 in the journal Nature, the scientists described their device as a surface acoustic wave (SAW) phonon laser that generates very small, rapid vibrations.

Owen Hughes is a freelance writer and editor specializing in data and digital technologies. Previously a senior editor at ZDNET, Owen has been writing about tech for more than a decade, during which time he has covered everything from AI, cybersecurity and supercomputers to programming languages and public sector IT. Owen is particularly interested in the intersection of technology, life and work ­– in his previous roles at ZDNET and TechRepublic, he wrote extensively about business leadership, digital transformation and the evolving dynamics of remote work.

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